PCB fabrication · PCBA · Engineering

PCB Manufacturing and Turnkey Assembly

Build prototypes and production orders with engineering review, controlled manufacturing data, PCB assembly and order-specific delivery support.

  • Rigid, HDI, rigid-flex, FPC, RF and high-speed boards
  • SMT, THT and mixed assembly with component sourcing
  • Coordinated from Shenzhen, built within a qualified manufacturing network
48L / 36LRigid layer countPrototype / mass production
9th / 5thHDI orderPrototype / mass production
1.5 / 2 milMin trace / spacePrototype / mass production
±5% / ±7%Impedance tolerancePrototype / mass production
RF / High-SpeedSpecialist PCB manufacturingLong-term material and factory partnerships
100%Pre-shipment inspectionFactory general

Source: ShinePCB capability workbook, 2025. Values are confirmed per order during engineering review.

Why engineers choose ShinePCB

Engineering review before quotation

Stack-up, materials, drill data and special processes are checked and questions raised before you commit to production.

Precise allocation to a qualified facility

Each order is matched to the facility in the ShinePCB manufacturing network whose process and qualification fit the requirements.

Prototype and production kept separate

Prototype and mass-production limits are quoted in separate columns, so the production build is planned on its own terms.

Certified PCB manufacturing

ISO 9001, IATF 16949, UL 796 and IECQ QC 080000 cover printed circuit board manufacturing.

Design data kept confidential

Gerber, BOM and design files are managed under an ISO/IEC 27001 information security system.

One record from quote to delivery

The accepted quotation, production scope and delivery information stay connected to your project.

PCB manufacturing

High-reliability PCB fabrication

From double-sided boards to 48-layer prototypes, HDI, rigid-flex and hybrid RF stack-ups. Production runs on automated imaging, drilling, plating and inspection lines with AOI, X-ray, flying-probe and impedance testing.

Our Shenzhen team coordinates your project and releases it to the facility in the ShinePCB manufacturing network that fits the process, material and quality requirements.

CNC drilling machines on the PCB production floor
PCB assembly

One project for boards and assembly

SMT, through-hole and mixed assembly with component sourcing through authorized distributors or customer-designated sources. Standard SMT handles 0201 chips and 0.5 mm BGA pitch; 01005 and finer pitches are available as advanced process.

Boards, cables, enclosures and mechanical parts can be combined into box-build projects.

SMT assembly line

Our certifications

Held for printed circuit board manufacturing. Documents on request.

Quality details
ISO 9001 certification mark
ISO 9001Quality Management System
IATF 16949 certification mark
IATF 16949Automotive Quality Management System
ISO 14001 certification mark
ISO 14001Environmental Management System
ISO 45001 certification mark
ISO 45001Occupational Health & Safety Management System
UL certification mark
ULProduct Safety Recognition / Material System
RoHS certification mark
RoHSEnvironmental Compliance
CQC certification mark
CQCProduct Certification
IECQ QC 080000 certification mark
IECQ QC 080000Hazardous Substance Process Management System
ISO/IEC 27001 certification mark
ISO/IEC 27001Information Security Management System
GB/T 29490 certification mark
GB/T 29490Intellectual Property Management System
Our network

Partners from our established network

Partner references retained from the previous website and grouped by relationship type.

Laminates & materialsMaterial suppliers
Sytech logoSytech
Panasonic logoPanasonic
Rogers logoRogers
Isola logoIsola
Taconic logoTaconic
ITEQ logoITEQ
Kingboard logoKingboard
China Jushi logoChina Jushi
Academic partnersSchools
University of Electronic Science and Technology of China logoUniversity of Electronic Science and Technology of China
Shenzhen Polytechnic University logoShenzhen Polytechnic University
Shandong University logoShandong University
Shenzhen University logoShenzhen University
Inner Mongolia University logoInner Mongolia University
University of Macau logoUniversity of Macau
Tsinghua University logoTsinghua University
Industry partnersCompanies
MEMSensing logoMEMSensing
HGZN logoHGZN
Transcom logoTranscom
QuantumCTek logoQuantumCTek
SCIYON logoSCIYON
PANDA logoPANDA
CRSC logoCRSC
BOE logoBOE
Bojay logoBojay
ShinePCB office reception in Shenzhen
About ShinePCB

High-frequency materials and disciplined PCB engineering

ShinePCB focuses on high-frequency and high-speed PCB engineering, with material experience across Rogers, Isola, Taconic, PTFE and low-loss laminates. Material systems are reviewed against frequency, loss, stack-up and availability targets.

Before quotation, PCB DFM review covers data completeness, stack-up, impedance, drill and route data, copper and spacing, special processes and test requirements. Engineering questions are resolved before production release.

  • High-frequency material selection and hybrid stack-up review
  • PCB DFM review before quotation and production release

Selected builds

Board constructions from the ShinePCB company presentation.

18-layer hybrid stack-up of a 77 GHz radar board

77 GHz radar high-frequency board

Layers
18
Materials
TSM-DS3 + FR28 prepreg + S1000-2M, hybrid lamination
Finish
Immersion gold (ENIG)
Special process
Pure PTFE blind/buried-via impedance board, 5 back-drill groups
Panels of black high-speed server boards

AI server high-speed board

Layers
18
Material
Panasonic MEGTRON 8
Thickness / min hole
3.1 mm / 0.15 mm
Finish
Full-board electrolytic hard gold
Challenge
High layer count, blind vias, thick gold over the full board
Rigid-flex boards with flexible interconnect

12-layer rigid-flex board

Structure
12 layers, 4R + 4F + 4R
Materials
ITEQ IT-180 + DuPont AP9141R
Thickness / min hole
1.6 mm / 0.2 mm
Finish
Immersion gold (ENIG)
Application
High-end industrial connector
Round gold-finished millimeter-wave antenna board

Millimeter-wave antenna board

Layers
8
Material
Rogers RT5880
Finish
Soft gold plating, 3 µm gold
Special process
Laser profiling
Stack of gold-finished RF power amplifier boards

5G base-station power amplifier board

Layers
4
Materials
Rogers RO4350B + FR-4
Finish
Immersion gold (ENIG)
Special process
Blind vias, step cavity, partially embedded copper block

Builds from the ShinePCB company presentation. They illustrate process scope and are not customer references.

Engineering and turnkey support

Support from design review to finished assembly

A coordinated service package for demanding PCB and automotive-electronics projects, backed by partner factories in Dalian, Zhuhai, Shenzhen, Ningbo and Wuhan.

  • Free engineering DFM review before quotation
  • Automotive-electronics support with project-matched certificates and supply-chain documentation
  • Design, testing and Turnkey services from sourcing through finished assembly
ShinePCB multilayer printed circuit board

Your PCB and PCBA partner from prototype to production

  • Engineering review before quotation and production release
  • Prototype and mass-production requirements reviewed separately
  • Each order matched to a qualified facility in the ShinePCB manufacturing network